Sr. Scientist, Advanced Concepts Engineer (ACE), Microelectronics Job at L3Harris Technologies

L3Harris Technologies Palm Bay, FL

Description:

Title: Sr. Scientist Advanced Concepts Engineer (ACE), Microelectronics

Req ID: SAS20230512-100750

Location: Palm Bay, FL

Job Description:

L3Harris Corporation is seeking a Senior Scientist, Advanced Concepts Engineer (ACE) for Microelectronics and Advanced Packaging at our Melbourne/Palm Bay, FL location. This is an opportunity to take on unique challenges, while building on your extensive knowledge of VLSI architectures, including your expertise relating to fabrication and packaging of multi-function microelectronics. Your professionally recognized skills and experience will deliver vital contributions to mission critical microelectronics solutions that help protect the U.S.A. and our allies. This is a multi-dimensional role that will include ‘front end’ communications with the Customer relating to technology and applications addressing emergent opportunities and continually evolving threats. Your technical and business acumen make you a ‘go to’ resource to support opportunity development, shaping, pursuit, capture, winning, execution, and delivery of key programs for the business area and parent corporation.

As the Senior Scientist ACE, you will:

  • Meet with our Internal and External Customer base to understand needs, requirements, budgets and timeframes to develop compliant technical solutions that meet their needs and budget limitations;
  • Understand and build relationships with the stakeholder and decision makers in the customer community to solidify our position as a trusted advisor;
  • Promote emergent state-of-the art practices, while building on your extensive relationships with commercial semiconductor manufacturers;
  • Liaise with Business Development (BD), and provide Engineering guidance to pursuits;
  • Work multiple tasks in a fast-paced environment, while adapting quickly to address emergent project priorities;
  • Develop technical documentation in support of gate review activities;
  • Ensure the logical and systematic development of total systems solutions that acknowledge technical, schedule, and cost constraints mapped against customer requirements and product capabilities;
  • Develop statements of work, technical volumes, project plans, resource estimates, and material needs;
  • Orchestrate artifact development within a collaborative matrix of engineering and functional support staff;
  • Develop concepts of operation (CONOPS) and Use Cases;
  • Work within and lead multi-disciplinary technical teams of subject matter experts (SMEs) to develop solutions meeting customer requirements;
  • Communicate technical information to diverse audiences, including Customers with disparate acumen;
  • Author & Co-Author whitepapers to document advanced concept solutions that address emergent requirements; and
  • Travel to meet in person with Customers and Strategic Partners for current and future development opportunities.

Qualifications:

As the Sr. Scientist Advanced Concepts Engineer (ACE), Microelectronics, you will possess:

  • A Master of Science degree in Electrical, Mechanical, Computer, Software or Systems Engineering (or similar technical discipline)
  • 20+ years of related experience (or 15+ years with a PhD)
  • A deep technical understanding of:
    • Advanced Microelectronics Packaging concepts (e.g.: MEMS, wafer bonding, die bonding, electromigration, under bump metallurgy, thermocompression bonding, solid liquid interdiffusion, C4, surface mount technology);
    • Back end of line wafer level processing (lithography, wet etch, dry etch, PVD, CVD, PECVD) and mechanisms of failure;
    • Thin film stress compensation methods;
    • Failure modes at cryogenic temperatures;
    • 3D die stacking, thermal issues, mechanical issues, electrical issues, assembly issues;
    • Methods and processes for creating die stacks and reliability issues associated with said processes;
    • Components (microprocessors, memory, clock, passives, etc.) and how to create systems from such components at the die level using silicon interposer technology; and
    • Through-Silicon vias (TSVs) technology, including its developmental and operational vulnerabilities.
    • Ability to obtain a Top Secret/SCI Clearance

Preferred/Additional Skills:

  • PhD in Electrical Engineeing, Mechanical Engineering, Materials Science, or Physics
  • Active Top Secret/SCI Clearance
  • Experience with classified government programs and acquisiton



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